The 35th AKB will take place at XFAB France on Nov. 9-10, 2023
2022: Infinon, Munich (D) Nov.17-18, 2022
- T. Rosenbaum:
"Member Matters"
- C. Weimer:
"Introduction SemiMod GmbH"
- G. U'ren:
"Heterogeneous GaN on RFSOI"
- F. Zaki, L. Iogna-Prat, H. Saleh and G. U'Ren:
"GaN ASM-HEMT DC Geometry Scaling Development"
- A. Biswas, P. Popp, M. Cotorogea, K.-W. Pieper, G. Alia:
"OptimizationTools forCalibrationof Compact Models for IGBTs and Diodes"
- T. Rosenbaum:
"A fun? presentation/quiz on parameter handling and the multiplication factor in SPICE simulators"
- G. Fischer, N. Hennig, T. Mausolf:
"Investigation of SiGe HBT and MOSFET Gate Oxide Reliability under RF Stress"
- C. Weimer, M. Schroter:
"Characterization and Modeling of SiGe HBT Reliability for RF Circuit Design"
- C. Weimer, M. Schroter:
"A Comparative SiGe and InP HBT RF Reliability Study"
- H. Alius, T. Gneiting:
"Modeling of CMOS Processes at Cryogenic Temperatures"
- D. Celi:
"Extraction of Junction Capacitance Parameters from C(V) Curves"
- Z. Huszka:
"Removing the ICK implied bumps in HICUM"
2021: Infineon, Munich (D) Nov.4-5, 2021
- T. Rosenbaum: "Agenda AKB 2021"
and "Member Matters"
- G. U'ren: "Introduction X-FAB France"
- M. Mueller, P. Kuthe, M. Krattenmacher, M. Schroter "Overview of Free Software Packages for Compact Modeling"
- D. Celi, Z. Huszka: "Parameter Extraction Using QucsStudio"
- K-W. Pieper: "Finding root causes of convergence failures in circuit simulation"
- T. Rosenbaum: "A look on characterization of semiconductor devices"
- G. Fischer: "What's the maximum tolerable current density for a SiGe HBT?"
- C. Weimer and M. Schroter: "An Experimental approach to investigating device-level RF reliability"
- F. Sischka: "Experiences with Using Gummel-Poon Models of Discrete Devices"
- P. Popp, M. Cotorogea, D. Ludwig, G. Alia, A. Biswas: "Behavioral
compact models of IGBTs and Si-diodes for data sheet simulations using
a machine learning based calibration strategy"
- X. Jin, G. Liang, and M. Schroter: "Characterization and modeling of thermal impedance for advanced SiGe HBT"
- Z. Huszka: "Revisiting the Extraction of γC"
2019: STM, Crolles (F) Nov. 14-15, 2019
2018: AdMOS,
Frickenhausen (D) Nov. 8-9, 2018
2017: XFab,
Erfurt (D)
2016:
Infineon,
Munchen (D)
2015: AMS,
Premstaetten (D)
2014:
STM, Crolles (D)
2013:
IHP Frankfurt (O)
2012:
Infineon
Technologies, Munich (D)
2011:
Infineon
Technologies, Munich (D)
2010:
STM, Crolles (F)
2009:
FHWS, W�rzburg
(D)
2008:
NXP Hamburg (D)
2007:
Infineon,
Munich (D)
2006:
X-FAB, Erfurt (D)
2005:
Bosch,
Reutlingen (D)
2004:
Atmel,
Heilbronn (D)
2003:
AMS
Unterpremstatten (A)
2002: Freescale, Munich (D)
2001:
IHP Frankfurt Oder (D)
2000:
Infineon, M�nchen (D)
1999:
Philips, Hamburg (D)
1998: TEMIC,
Heilbronn (D)
1997:
ALCATEL, Stuttgart (D)
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