Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
7th Sino MOS-AK Workshop in Nanjing (CN)
scheduled for August 11-13, 2023 (online/onsite)
Open Directory
MOS-AK: Enabling Compact Modeling R&D Exchange
Preannouncement and Call for Papers
Important Date:
  • Call for Papers - Jan 2023
  • 2nd Announcement - April 2023
  • Final Workshop Program - July 2023
  • 7th Sino MOS-AK Workshop -  Aug. 11-13, 2023 (online/onsite)
MOS-AK (online/onsite)
Online Registration to be open (July 2023)
any related enquiries can be sent to

 Synopsis and Workshop Topics
  • Together with local host, as well as all the Extended MOS-AK TPC Committee, would like to invite you to the 7th Sino MOS-AK Workshop in Nanjing (CN) which will be organized as the online/onsite  event on August 11-13, 2023 providing an opportunity to meet the internation modeling experts, engineers and researchers. A training course related to SiC topic (device modeling, packaging model, circuit, module and final application is planned for the first MOS-AK day, following by two days of the MOS-AK compact/SPICE modeling and its Verilog-A discussions. 
  • HiTech forum to discuss the frontiers of electron device modeling with emphasis on simulation-aware compact/SPICE models and its Verilog-A standardization.
  • MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme - frontiers of the compact modeling for nm-scale MEMS/NEMS designs, CMOS/SOI and HEMT IC simulation.
  • The specific workshop goal will be to classify the most important directions for the future development of the electron device models, not limiting the discussion to compact models, but including physical, analytical and numerical models, to clearly identify areas that need further research and possible contact points between the different modeling domains. This workshop is designed for device process engineers (CMOS, SOI, BiCMOS, SiGe, GaN, InP) who are interested in device modeling; ICs designers (RF/Analog/Mixed-Signal/SoC/Bio/Med) and those starting in that area as well as device characterization, modeling and parameter extraction engineers. The content will be beneficial for anyone who needs to learn what is really behind the IC simulation in modern device models in particular using free open source PDKs.
Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
  • Compact Modeling (CM) of the electron devices
  • Advances in semiconductor technologies and processing
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • Open Source (FOSS) TCAD/EDA modeling and simulation
  • CM of passive, active, sensors and actuators
  • Emerging Devices, Organic TFT, CMOS and SOI-based memory
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS, BiCMOS, SiGe, GaN, InP devices and circuits
  • Technology R&D, DFY, DFT and reliability/aging IC designs
  • Foundry/Fabless Interface Strategies (eg: Skywater 130nm CMOS)
Online papers submission TBO
any related enquiries can be sent to

International MOS-AK Compact Modeling Committee

IEEE Membership
International R&D Advisory Board

Larry Nagel, Omega Enterprises Consulting (USA)
Fellow Member
Andrei Vladimirescu, UCB (USA); ISEP (FR)
Fellow Member
MOS-AK Compact Modeling TPC Chair

Wladek Grabinski, MOS-AK (EU)
Senior Member
North America TPC:  
Pekka Ojala, Exar Corporation (USA)
Geoffrey Coram, Analog Devices (USA) Senior Member
Jamal Deen, U.McMaster (CAN)
Fellow Member
Roberto Tinti, Keysight EEsof Division (USA)


South America TPC:

Gilson I Wirth, UFRGS (BR)
Senior Memner
Sergio Bampi, UFRGS (BR)
Antonio Cerdeira Altuzarra, Cinvestav-IPN (MX)
Senior Member
Roberto S. Murphy, INAOE (MX) Senior Member
Europe TPC:
Ehrenfried Seebacher, ams AG (A) .
Thomas Gneiting, AdMOS (D)
Benjamin Iniguez, URV (SP) Fellow Member
Daniel Tomaszewski, IMiF Warsaw (PL) Senior Member
Asia/Pacific TPC:
Sadayuki Yoshitomi, Kioxia (J) Member
Min Zhang, XMOD, Shanghai (CN)
Kaikai Xu, UESTC Chengdu (CN) Senior Member
update: Jan.2023  (rev. a)
Contents subject to change (C)1999-2023 All rights reserved. WG