Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group
Q1 2022 MOS-AK Panel

(virtual/online) Feb. 25, 2022  
Open Directory
MOS-AK: Enabling Compact Modeling R&D Exchange
Q12022 MOS-AK Panel Recap
  • MOS-AK Panel Feb.25, 2022 
    • 5:00pm - 7pm (CET)

 Synopsis and Workshop Topics
  • MOS-AK is a HiTech forum to discuss the frontiers of electron device modeling with emphasis on simulation-aware compact/SPICE models and its Verilog-A standardization.
  • MOS-AK Panel is organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover the important aspects of compact model development, implementation, deployment and standardization foccusing on the FOSS EDA tools suppot. 
Topics: to be covered include the following:
  • Compact Modeling (CM) of the electron devices
  • Verilog-A language for CM standardization
  • Open Source FOSS EDA modeling and simulation
MOS-AK Panel Presentation
P1Xyce: A short overview
Jason C Verley and Eric R Keiter
Sandia Labs (US)
P2OpenVAF Verilog-A Compiler
P. Kuthe, M. Muller, M. Krattenmacher, M. Schroeter
TU Dresden, 01062 Dresden (D)
SemiMod UG, Dresden (D)
P3Qucs-S: A short overview on development status
Vadim Kuznetsov
Qucs-S developer
P4Advances in Qucs-S schematic capture for compact modelling and simulation
Mike Brinson
London Metropolitan University (UK)
P5Ngspice circuit simulator
Holger Vogt
Duisburg (D)
International MOS-AK Compact Modeling Committee

IEEE Membership
International R&D Advisory Board

Larry Nagel, Omega Enterprises Consulting (USA)
Fellow Member
Andrei Vladimirescu, UCB (USA); ISEP (FR)
Fellow Member
MOS-AK Compact Modeling TPC Chair

Wladek Grabinski, MOS-AK (EU)
Senior Member
North America TPC:  
Pekka Ojala, Exar (USA)
Geoffrey Coram, Analog Devices (USA) Senior Member
Jamal Deen, U.McMaster (CAN)
Fellow Member
Roberto Tinti, Keysight EEsof Division (USA)


South America TPC:

Gilson I Wirth, UFRGS (BR)
Senior Memner
Sergio Bampi, UFRGS (BR)
Antonio Cerdeira Altuzarra, Cinvestav-IPN (MX)
Senior Member
Roberto S. Murphy, INAOE (MX) Senior Member
Europe TPC:
Ehrenfried Seebacher, ams AG (A) .
Thomas Gneiting, AdMOS (D)
Benjamin Iniguez, URV (SP) Fellow Member
Daniel Tomaszewski, IMiF Warsaw (PL) Senior Member
Asia/Pacific TPC:
Sadayuki Yoshitomi, Kioxia (J) Member
Rakesh Vaid, University of Jammu (IN)Senior Member
Min Zhang, XMOD, Shanghai (CN)
Yuehang Xu, UESTC Chengdu (CN)

Kaikai Xu, UESTC Chengdu (CN)Senior Member
update: MAR. 2022 (rev.f)
Contents subject to change (C) 1999-2022 All rights reserved. WG